2.8 PCB Checklist

Schematic Checklist

Schematic should compile without errors
All signals entering or leaving the board shall have ESD protection
All power entering or leaving a board shall have reverse voltage protection and fusing located as close as possible to the connector
Schematic notes shall be included for all complex calculations and design decisions, and these should be reflected in the board's confluence page
If they are present and relevant, include diagrams or reference schematics from application notes in the schematic or in an associated confluence page
Switching regulators should have sufficient and appropriately sized input/output/compensation capacitors as recommended by the datasheet. In particular, pay attention to dc bias capacitance de-rating.
All components should have been reviewed
No overlapping text such as net names
As much as possible, nets that are not connected should not cross each other in the schematic.
All pins and wires should be aligned to a 50 mil grid
All pins should be connected or marked with Generic No ERC if not needed
Optional components shall be Standard No BOM
Check for passive components connected in series without any junctions

Make sure PCB design rules are set correctly to voltage, routing, and board house requirements

PCB Checklist

Set design rules
Get board shape
Place mechanical interfacing connectors and indicators
Place and route power components
Place microcontroller and supporting components
Route high-speed
Route microcontroller and supporting components
Place and route rest of components
PCB shall have a board clearance set and a larger board clearance set when panelized
PCB should pass all DRC except silkscreen related errors, and violations should be waived if really necessary
Bypass and decoupling capacitors should be placed and routed appropriately. This is particularly relevant for power supplies, and even more relevant for switch-mode power supplies.
ESD protection shall be as close to the connector as possible
Do you need thermal reliefs? Why or why not?
If using ground pours in addition to a single unbroken ground plane, the ground planes shall be stitched together as densely as possible with vias
High speed traces shall not cross reference planes or change layers, except where absolutely necessary.
No components should be floating
All traces should be connected at both ends unless intended as an antenna
All copper shall be connected. No floating copper is allowed. This includes copper text on an external layer (don't do it).
There shall be no traces on the ground plane. The ground plane shall be as solid and unbroken as possible.
Teardrops should be on the majority of pads

Check each layer’s copper (isolating layers in 3D view is a good way to do this)