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2.8 PCB Checklist

2.8 PCB Checklist

Feb 04, 2023

Nice one I found online: https://pcbchecklist.com/

Schematic Checklist

  • Schematic should compile without errors

  • All signals entering or leaving the board shall have ESD protection

  • All power entering or leaving a board shall have reverse voltage protection and fusing located as close as possible to the connector

  • Schematic notes shall be included for all complex calculations and design decisions, and these should be reflected in the board's confluence page

  • If they are present and relevant, include diagrams or reference schematics from application notes in the schematic or in an associated confluence page

  • Switching regulators should have sufficient and appropriately sized input/output/compensation capacitors as recommended by the datasheet.  In particular, pay attention to dc bias capacitance de-rating.

  • All components should have been reviewed

  • No overlapping text such as net names

  • As much as possible, nets that are not connected should not cross each other in the schematic.

  • All pins and wires should be aligned to a 50 mil grid

  • All pins should be connected or marked with Generic No ERC if not needed

  • Optional components shall be Standard No BOM

  • Check for passive components connected in series without any junctions



Make sure PCB design rules are set correctly to voltage, routing, and board house requirements

PCB Checklist

  • Set design rules

  • Get board shape

  • Place mechanical interfacing connectors and indicators

  • Place and route power components

  • Place microcontroller and supporting components

  • Route high-speed

  • Route microcontroller and supporting components

  • Place and route rest of components

  • PCB shall have a board clearance set and a larger board clearance set when panelized

  • PCB should pass all DRC except silkscreen related errors, and violations should be waived if really necessary

  • Bypass and decoupling capacitors should be placed and routed appropriately.  This is particularly relevant for power supplies, and even more relevant for switch-mode power supplies. 

  • ESD protection shall be as close to the connector as possible

  • Do you need thermal reliefs?  Why or why not?

  • If using ground pours in addition to a single unbroken ground plane, the ground planes shall be stitched together as densely as possible with vias

  • High speed traces shall not cross reference planes or change layers, except where absolutely necessary.

  • No components should be floating

  • All traces should be connected at both ends unless intended as an antenna

  • All copper shall be connected.  No floating copper is allowed.  This includes copper text on an external layer (don't do it).

  • There shall be no traces on the ground plane.  The ground plane shall be as solid and unbroken as possible.

  • Teardrops should be on the majority of pads



Check each layer’s copper (isolating layers in 3D view is a good way to do this)