BMS Test Plan

Owned by Joshua Harper
Last updated: Nov 02, 2022
1 min read

Post-Assembly

Check all required components are assembled and DNP components are not assembled
Verify components oriented correctly (polarity, pin 1 designators, etc.)
Verify there are no bridges between parts/pins creating unwanted shorts
Verify general soldering quality - no stray solder, burns, etc., all pins and pads connected with enough solder

Unpowered Tests

Verify power rails are not shorted to GND or with each other
Verify EN/RST/SHDN pins are not shorted to either GND or a power rail, unless it is supposed to be
Verify communication protocol lines (i.e. SDA & SCL for I2C, MISO MOSI SCLK & CS for SPI, etc.) are not shorted with each other, with a power rail, or GND

If any shorts are found, do not connect the board to a power supply. Locate and attempt to fix the cause of any shorts before continuing.

Basic Powered Tests

General Tests:

Power on board + touch test, verify components and the board itself does not get too hot
Probe power rails, verify correct voltage
Verify all ICs, components, LEDs, etc. are powered on successfully. Communicate with all peripherals
Program microcontroller

3V3 buck converter:

Enable conditions function as expected
Verify output current limit
Verify output voltage limit

Chip:

Verify reasonable SOC reading
Verify low SOC warning (buzzer)

Performance Tests

Cell balancing accuracy
Display output accuracy